Solid wire

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United States of America Patent

PATENT NO 8461485
APP PUB NO 20080156784A1
SERIAL NO

11945062

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A solid wire contains in mass percent C 0.005 to 0.080%, Si 0.30 to 1.20%, Mn 1.15 to 1.65%, S 0.050 to 0.200%, P 0.017% or less, O 0.0070% or less, and N 0.0050% or less, wherein C+(P*5)≦0.135 mass percent is satisfied, and the remainder includes Fe and impurities, and the content of each of Ti, B, Cr, Ni, Nb, V, Zr, La and Ce as the impurities is controlled to be a certain content or less, and the amount of adhered oil on a surface of the relevant solid wire is controlled to be 1.2 g or less per wire of 10 kg. According to such a configuration, while increase in welding cost is controlled to the minimum, stability of wire feed, burn-through resistance, undercut resistance, and crack resistance becomes excellent, slag and spatter becomes hard to be generated, hardness of weld metal becomes equal to or higher than that of base metal, and brittle fracture becomes hard to occur.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL LTD )2-4 WAKINOHAMA-KAIGANDORI 2-CHOME CHUO-KU KOBE-SHI HYOGO 6518585 ?6518585

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Suzuki, Reiichi Fujisawa, JP 63 212
Umehara, Yu Fujisawa, JP 6 25

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