Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device
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United States of America Patent
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Jun 11, 2013
Grant Date -
Oct 14, 2010
app pub date -
Apr 2, 2010
filing date -
Apr 13, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A packaging substrate device includes: a first laminate including a first ceramic substrate and a first copper pattern disposed on an upper surface of the first ceramic substrate; and a second laminate disposed over the first copper pattern and including a second ceramic substrate, a second copper pattern that is disposed on an upper surface of the second ceramic substrate, and a through hole extending through the second ceramic substrate and the second copper pattern to expose a copper portion of the first copper pattern. A light emitting semiconductor die can be mounted on the copper portion within the through hole. Efficient heat dissipation can be achieved through the first laminate.
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