Per die temperature programming for thermally efficient integrated circuit (IC) operation
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United States of America Patent
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Jun 11, 2013
Grant Date -
May 31, 2012
app pub date -
Oct 25, 2011
filing date -
Jun 29, 2006
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Abstract
Methods and apparatus to provide per die temperature programming for thermally efficient integrated circuit (IC) operation are described. In some embodiments, the junction temperature of an IC component is determined, e.g., to reduce power consumption and/or improve performance. Other embodiments are also described.
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