Board-level package with tuned mass damping structure

United States of America Patent

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Jun 11, 2013
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Nov 15, 2012
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May 11, 2011
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May 11, 2011

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Abstract

A board-level package includes a printed circuit board, a semiconductor die package mounted on the printed circuit board, a tuned mass structure, and a support structure mounted to the printed circuit board and supporting the tuned mass structure.

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Patent Owner	Address
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD	HSINCHU

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Inventor Name	Address	# of filed Patents	Total Citations
Lin, Po-Yao	Zhudong Township, Hsinchu County, TW	271	1156
Lin, Wen-Yi	New Taipei, TW	81	1412

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Board-level package with tuned mass damping structure

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United States of America Patent

13105577

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PATENT NO	8462510
APP PUB NO	20120287579A1
SERIAL NO	13105577
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 11, 2013	US,8462510,B2 US8462510B2	GRANTED PATENT AS SECOND PUBLICATION
November 15, 2012	US,20120287579,A1 US20120287579A1	FIRST PUBLISHED PATENT APPLICATION

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13105577

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