Emissivity profile control for thermal uniformity
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United States of America Patent
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Jun 18, 2013
Grant Date -
Aug 2, 2012
app pub date -
Feb 1, 2011
filing date -
Feb 1, 2011
priority date (Note) -
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Abstract
A substrate for processing in a heating system is disclosed. The substrate includes a bottom portion for absorbing heat from a radiating heat source, the bottom portion having a first region having a first emissivity and a second region having a second emissivity less than the first emissivity. The first region and the second region promote thermal uniformity of the substrate by compensating for thermal non-uniformity of the radiating heat source.
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