Substrate processing apparatus and gas supply method

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United States of America Patent

PATENT NO 8465593
APP PUB NO 20080182423A1
SERIAL NO

12014537

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus that can prevent formation of deposit in openings of a plurality of gas supply holes leading into a processing chamber. Each of the gas supply holes is configured to uniformly supply a processing gas, whose molecules are turned into clusters, into the processing chamber and to prevent liquefaction of processing gas when the processing gas is supplied into the processing chamber.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayashi, Daisuke Nirasaki, JP 252 4626
Takanashi, Morihiro Nirasaki, JP 9 407

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