Carbon containing low-k dielectric constant recovery using UV treatment
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United States of America Patent
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Jun 18, 2013
Grant Date -
May 19, 2011
app pub date -
Dec 20, 2010
filing date -
Oct 30, 2006
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Abstract
A method for the ultraviolet (UV) treatment of carbon-containing low-k dielectric and associated apparatus enables process induced damage repair. The methods of the invention are particularly applicable in the context of damascene processing to recover lost low-k property of a dielectric damaged during processing, either pre-metallization, post-planarization, or both. UV treatments can include an exposure of the subject low-k dielectric to a constrained UV spectral profile and/or chemical silylating agent, or both.
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