Stacked microelectronic assemblies having vias extending through bond pads
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United States of America Patent
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Jun 18, 2013
Grant Date -
Sep 16, 2010
app pub date -
Mar 12, 2010
filing date -
Mar 13, 2009
priority date (Note) -
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Abstract
A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.
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