Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

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United States of America Patent

PATENT NO 8471709
APP PUB NO 20100181381A1
SERIAL NO

12749355

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Importance

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Abstract

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An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically interconnected to the conductive layer.

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Patent Owner(s)

  • RUIZHANG TECHNOLOGY LIMITED COMPANY

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carrender, Curt Morgan Hill, US 17 1004

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