Method of fabricating a polishing pad

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8480773
APP PUB NO 20110241258A1
SERIAL NO

13160018

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Abstract

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A polishing pad having a compressibility-aiding stripe buried therein is fabricated by assembling the compressibility-aiding stripe in a mold cavity, filling the mold cavity with a polymer material, and releasing the polishing pad from the mold. Embodiments include assembling a compressibility-aiding stripe comprising a solid pillar of material having a larger compressibility than that of the polishing pad body, and releasing a single layer polishing pad from the mold.

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Patent Owner(s)

Patent OwnerAddress
IV TECHNOLOGIES CO LTDNO 12 ROAD 9 TAICHUNG INDUSTRIAL PARK TAICHUNG CITY 407

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Shen-Yu Taichung, TW 2 4
Chang, Yung-Chung Taipei, TW 20 272
Shih, Wen-Chang Taichung, TW 18 115

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