Method of forming semiconductor device having a capacitor

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United States of America Patent

PATENT NO 8481398
APP PUB NO 20100240191A1
SERIAL NO

12659548

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of forming a semiconductor device includes forming a lower electrode layer on a substrate, forming a surface oxide layer on the lower electrode layer, partially removing the lower electrode layer to form a lower electrode, removing the surface oxide layer to expose the lower electrode, forming a capacitor dielectric layer on the lower electrode, and forming an upper electrode on the capacitor dielectric layer.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chung, Jung-Hee Suwon-si, KR 31 196
Chung, Seung-Sik Seoul, KR 2 18
Kim, Young-Jin Yongin-si, KR 190 1303
Lim, Han-Jin Seoul, KR 51 395
Nam, Seok-Woo Seongnam-si, KR 38 259
Yoon, Kyoung-Ryul Goyang-si, KR 18 206

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