Thermally expanded microspheres and a process for producing the same
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United States of America Patent
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Jul 16, 2013
Grant Date -
May 17, 2012
app pub date -
Jan 23, 2012
filing date -
Sep 16, 2005
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Abstract
The present invention provides heat-expanded microspheres having high packing efficiency, and a production method thereof. The heat-expanded microspheres are produced by expanding heat-expandable microspheres, which comprise shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.
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