Abrasive particles, method of manufacturing the abrasive particles, and method of manufacturing chemical mechanical polishing slurry

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United States of America Patent

PATENT NO 8491682
APP PUB NO 20090193721A1
SERIAL NO

12344458

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Abstract

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Disclosed are abrasive particles, a method for manufacturing the abrasive particles, and a method for manufacturing a Chemical Mechanical Polishing (CMP) slurry. The method for manufacturing abrasive particles for the CMP slurry includes preparing a raw material precursor, drying the raw material precursor, and calcining the dried raw material precursor using a calcination furnace where a gas atmosphere having relatively less oxygen in comparison with an air atmosphere is created.

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Patent Owner(s)

Patent OwnerAddress
KCTECH CO LTD30 JE2GONGDAN 3-GIL MIYANG-MYEON GYEONGGI-DO ANSEONG-SI 17599

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hong, Suk Min Gyeonggi-do, KR 8 39
Hwang, Joon Ha Gyeonggi-do, KR 9 11
Kim, Dong Hyun Seoul, KR 492 2780
Kim, Jeong Yun Seoul, KR 32 218
Kim, Yong Kuk Gyeonggi-do, KR 21 61
Suh, Myung Won Gyeonggi-do, KR 3 3

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