Protected solder ball joints in wafer level chip-scale packaging
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United States of America Patent
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Jul 23, 2013
Issued Date -
N/A
app pub date -
Nov 16, 2007
filing date -
Nov 16, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress.
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