Polyimide resin composition, polyimide precursor resin composition for the same, production method thereof, and polyimide film and production method thereof
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United States of America Patent
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Jul 23, 2013
Grant Date -
Oct 28, 2010
app pub date -
Aug 7, 2008
filing date -
Aug 14, 2007
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Abstract
An object of the present invention, which was made to solve the problems above, is to provide a polyimide precursor resin composition superior in transparency allowing reduction of the residual volatile material rate during molding and giving a polyimide resin composition (e.g., polyimide film) superior in mechanical properties and transparency even when a cheaper polyamide-imide is used. The present invention relates to a polyimide precursor resin composition, comprising a polyamide-imide (A) containing a diamine monomer unit represented by the following formula (1) and a polyamic acid (B) containing at least one kind of monomer unit selected tetracarboxylic acid monomer units represented by the following formulae (2p) to (2r), wherein the haze of the film having a thickness of 40 μm obtained by imidation of the polyimide precursor resin composition is 4% or less:
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