Adhesive composition
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United States of America Patent
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Aug 6, 2013
Grant Date -
Aug 12, 2010
app pub date -
Jan 28, 2010
filing date -
Feb 6, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A sealing compound composition as an adhesive composition contains a vinyl chloride resin, a plasticizer, a filler, a moisture absorbent and an acrylic resin as a pH control material. The moisture absorbent is blended within a range of 0.3 to 2.0% by weight. The acrylic resin is blended within a range of 1.0% by weight or more to less than 7.0% by weight. A blending ratio of the moisture absorbent is half or less than that of the acrylic resin.
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