Layered composite for a card body and method for producing the layered composite
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United States of America Patent
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Aug 13, 2013
Grant Date -
Feb 3, 2011
app pub date -
Mar 13, 2009
filing date -
Mar 18, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to a layered composite (10) for producing a card body comprising a chip module (12) for a chip card, having a substrate layer arrangement (11) for arranging the chip module, and having intermediate layers (18, 19) disposed on both sides of the substrate layer arrangement, each having a cover layer (21, 22), wherein the substrate layer arrangement and the cover layers are designed in relation to the intermediate layers such that the substrate layer arrangement and the cover layers are formed as layers having a relatively rigid shape and hard surfaces, and the intermediate layers are formed as layers having a relatively elastic shape and soft surfaces, and also relates to a method for producing a layered composite.
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