Cyclic self-limiting CMP removal and associated processing tool
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United States of America Patent
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Aug 13, 2013
Grant Date -
Oct 20, 2011
app pub date -
Apr 15, 2010
filing date -
Apr 15, 2009
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Abstract
A cyclic method of chemical mechanical polishing (CMP) a wafer having a surface includes placing the wafer on a platen in a CMP apparatus and then performing a multi-step CMP comprising process. The multi-step CMP process includes delivering a first chemical composition onto the wafer while on the platen for a first time duration, and without removing the wafer from the platen, delivering a second chemical composition different from the first composition onto the wafer for a second time duration after the first time duration. The multi-step CMP comprising process includes CMP removal using a slurry during one of the first and second time durations and a non-polishing process during the other of the first and second time durations. The multi-step CMP comprising process is repeated a plurality of times.
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