Sensor device protected by a film layer and a resin layer
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United States of America Patent
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Aug 20, 2013
Grant Date -
Nov 17, 2011
app pub date -
May 11, 2009
filing date -
Jan 13, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A sensor element assembly, including: a sensor element; lead frames provided with the sensor element therebetween, the lead frames fixing the sensor element; a first head protection film protecting the sensor element fixed between the lead frames; an insulating film covering the first head protection film and the lead frames to insulate the lead frames; and a second head protection film (resin layer) further covering the head covered with the insulating film. The sensor element assembly is advantageous in that an epoxy resin layer is formed on a film layer covering a sensor element, so that the strength of the sensor element assembly can be maintained by the epoxy resin layer itself, thereby improving the impact resistance and compressive strength thereof.
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