Semiconductor device having die pads isolated from interconnect portion and method of assembling same

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United States of America Patent

PATENT NO 8519519
APP PUB NO 20120104583A1
SERIAL NO

12938376

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Abstract

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A semiconductor device includes a lead frame that has a die interconnect portion and at least first and second die pads. The die interconnect portion is isolated from the die pads. The device also includes a first die and a second die attached to the first and second die pads and electrically connected to each other by way of the die interconnect portion. The first die is encapsulated in a first medium and the second die is encapsulated in a second medium, the first medium being different from the second medium.

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Patent Owner(s)

  • NXP USA, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Beng Siong Ampang, MY 1 11
Teh, Guat Kew Subang Jaya, MY 2 20
Wong, Wai Keong Shah Alam, MY 12 47

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