Decoupling capacitor circuit assembly
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United States of America Patent
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Aug 27, 2013
Grant Date -
N/A
app pub date -
Oct 25, 2005
filing date -
Oct 25, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Decoupling capacitor circuit assembly is described. In one example, a circuit assembly includes a passive substrate, a plurality of terminals, and at least one capacitor. The passive substrate includes a top surface and a bottom surface. The plurality of terminals is formed on the top surface and is configured for electrical communication with a respective plurality of lands on a printed circuit board (PCB). The at least one capacitor is mounted to the bottom surface of the passive substrate and is configured to provide decoupling capacitance for an integrated circuit (IC) on the PCB. Each capacitor is coupled to a pair of the plurality of terminals. In another example, a circuit assembly includes a PCB, and IC mounted to the PCB, a passive substrate mounted to the PCB, and at least one capacitor mounted to the passive substrate for providing decoupling capacitance for the IC.
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