Connecting film, and joined structure and method for producing the same
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United States of America Patent
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Sep 3, 2013
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app pub date -
Sep 13, 2012
filing date -
Nov 20, 2008
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Abstract
A method for producing a joined structure involving pressure-bonding a first circuit member and a second circuit member together via a connecting film while the circuit members are being heated, to thereby join the circuit members with each other, wherein the connecting film is defined and includes first and second layers wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than the minimum melt viscosity of the insulating organic resin layer.
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