Leadframe package for high-speed data rate applications

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8525310
APP PUB NO 20110248394A1
SERIAL NO

13085446

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Abstract

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A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.

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Patent Owner(s)

Patent OwnerAddress
MEDIATEK INCNO 1 DUSING RD 1ST SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chun-Wei New Taipei, TW 152 751
Chang, Sheng-Ming New Taipei, TW 27 237
Chen, Nan-Cheng Hsin-Chu, TW 43 540
Chen, Nan-Jang Hsinchu, TW 38 406
Jao, Che-Yuan Hsinchu, TW 17 148
Li, Ching-Chih New Taipei, TW 17 79

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