Method for cutting a material layer by means of a cutting beam
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United States of America Patent
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Sep 3, 2013
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app pub date -
Dec 13, 2010
filing date -
Dec 17, 2009
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Abstract
In the method for cutting a material layer (20) along a given cutting line (21), a cutting beam is moved so as to impinge on the material layer (20) laterally offset by a distance (W) from the cutting line (21). The distance (W) is determined as a function of the variations of the cutting speed at which the cutting beam is moved, and/or as a function of the deviations of the effective cutting beam cross-section from a circular shape.
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