Semiconductor device structures and their fabrication

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United States of America Patent

PATENT NO 8530984
APP PUB NO 20130105995A1
SERIAL NO

13720690

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Abstract

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A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.

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Patent Owner(s)

  • TEXAS INSTRUMENTS INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Diep, Buu Quoc Murphy, US 13 99
Green, Jason C Richardson, US 5 27
Koehl, Daryl Ross Garland, US 4 25
Stevenson, Clayton Lee Keller, US 5 23

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