Method of bonding two structures together with an adhesive line of controlled thickness
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United States of America Patent
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Sep 17, 2013
Issued Date -
N/A
app pub date -
Oct 16, 2009
filing date -
Jun 25, 2007
priority date (Note) -
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Abstract
A method of bonding two structures together with an adhesive line of controlled thickness is provided. The method includes: applying an adhesive of controlled thickness to a first surface of a first structure; at least partially curing the adhesive; applying additional adhesive to the partially cured adhesive applied to the first surface or to a second surface of a second structure; holding the first structure and the second structure in alignment with the first surface and the second surface disposed in spaced, opposing relation; applying a force to the first structure and/or the second structure to squeeze the additional adhesive between the second surface and the partially cured adhesive applied to the first surface to reduce a thickness of the additional adhesive; and at least partially curing the additional adhesive to bond the first and second structures together.
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