Heat sink interface having three-dimensional tolerance compensation
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United States of America Patent
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Sep 17, 2013
Grant Date -
Mar 31, 2011
app pub date -
Sep 25, 2009
filing date -
Sep 25, 2009
priority date (Note) -
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Abstract
A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.
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