Chemical mechanical polishing composition and methods relating thereto

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United States of America Patent

PATENT NO 8540893
APP PUB NO 20100029079A1
SERIAL NO

12185600

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Abstract

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A chemical mechanical polishing composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The chemical mechanical polishing composition comprises an inhibitor for the nonferrous metal; a copolymer of poly(ethylene glycol)methyl ether (meth)acrylate and 1-vinylimidazole; and water.

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Patent Owner(s)

  • ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ghosh, Tirthankar Oreland, US 57 423
Ibbitson, Scott A Trappe, US 8 97
Thomas, Terence M Newark, US 39 403
Wang, Hongyu Wilmington, US 152 2274

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