Circuit board having holes to increase resonant frequency of via stubs
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United States of America Patent
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Sep 24, 2013
Grant Date -
Nov 3, 2011
app pub date -
Apr 29, 2010
filing date -
Apr 29, 2010
priority date (Note) -
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Abstract
A circuit board includes layers, a pair of vias filled with a conductive material and extending through the layers, first and second pairs of conductive signal paths, and holes extending at least partially through the layers and located between the pair of vias. The first pair of conductive paths is connected to the pair of vias within a first layer; the second pair of conductive paths is connected to the pair of vias within a second layer. The pair of vias has a pair of via stubs defined between the second layer and a bottom layer. A differential signal is to be transmitted between the first and second pairs of conductive signal paths via the pair of vias. The holes have a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal.
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