Heat dissipation device and method for manufacturing the same

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United States of America Patent

PATENT NO 8544530
APP PUB NO 20100252239A1
SERIAL NO

12534879

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Abstract

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A heat dissipation device includes a plurality of fins, a plurality of heat pipes connected to the fins in a thermal conductive relationship and a plurality of electric conductors extending through the fins. The fins are stacked together and spaced from each other. The heat pipes are extended through the fins. The electric conductors are electrically connected to the fins to enable consistent metal oxide films to be formed all over surfaces of the fins when anodizing the fins.

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Patent Owner(s)

Patent OwnerAddress
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO LTDNO 2 2ND DONGHUAN ROAD LONGHUA TOWN BAO' AN DISTRICT SHENZHEN CITY GUANGDONG PROVINCE
FOXCONN TECHNOLOGY CO LTD(236)NO 3-2 CHUNG SHAN ROAD TU-CHENG DIST NEW TAIPEI 236

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chun-Chi Taipei Hsien, TW 326 2724
Li, Wei Shenzhen, CN 2284 14552
Wu, Yi-Qiang Shenzhen, CN 51 343

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