Method for improving the bonding properties of microstructured substrates, and devices prepared with this method
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United States of America Patent
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Oct 1, 2013
Grant Date -
Apr 29, 2010
app pub date -
Dec 11, 2007
filing date -
Dec 11, 2006
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Abstract
A method for treating the surface of a polymerio substrate, including the following steps: providing a first polymeric substrate; contracting at least one part of one face of the first substrate with some liquid solvent system, the liquid solvent system containing at least a first volatile compound and at least a second compound having a low molecular weight and able to swell and/or soften the polymeric material forming the face; letting at least the volatile compound to evaporate from the face of the first substrate and; contracting the so-treated face of first substrate with a third material.
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