Fabric containing non-crimped fibers and methods of manufacture

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8546260
APP PUB NO 20110171831A1
SERIAL NO

13062312

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Abstract

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A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount of 1.0% by weight to 98.0% by weight in the mat and wherein the non-crimped fibers have a length of 0.1 cm to 127 cm and a diameter of 1.0 to 1000 micrometers.

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Patent Owner(s)

Patent OwnerAddress
FNS TECH CO LTD246 SINGAL-RI JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNG-NAM

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsu, Oscar K Chelmsford, US 17 139
Lefevre, Paul Topsfield, US 16 156

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