Die stacking with an annular via having a recessed socket
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United States of America Patent
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Oct 1, 2013
Grant Date -
Nov 15, 2012
app pub date -
Jul 23, 2012
filing date -
Apr 22, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A die stack including a die having an annular via with a recessed conductive socket and methods of forming the die stack provide a structure for use in a variety of electronic systems. In an embodiment, a die stack includes a conductive pillar on the top of a die inserted into the recessed conductive socket of another die.
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