Die stacking with an annular via having a recessed socket

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United States of America Patent

PATENT NO 8546919
APP PUB NO 20120286424A1
SERIAL NO

13556026

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Abstract

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A die stack including a die having an annular via with a recessed conductive socket and methods of forming the die stack provide a structure for use in a variety of electronic systems. In an embodiment, a die stack includes a conductive pillar on the top of a die inserted into the recessed conductive socket of another die.

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Patent Owner(s)

  • MICRO TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pratt, Dave Meridian, US 20 428

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