Method of making circuit board module

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United States of America Patent

PATENT NO 8549739
APP PUB NO 20100288537A1
SERIAL NO

12800414

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Abstract

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A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.

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Patent Owner(s)

Patent OwnerAddress
TONG HSING ELECTRONIC INDUSTRIES LTDNO 88 LN 1125 HEPING RD BADE DIST TAOYUAN CITY 334

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiang, Wen-Chung Lujhu Township, TW 13 73
Fu, Ming-Huang Lujhu Township, TW 5 16
Hsieh, Ying-Chi Lujhu Township, TW 5 16
Lu, Cheng-Kang Lujhu Township, TW 6 16
Wu, Keng-Chung Lujhu Township, TW 6 23

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