Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device
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United States of America Patent
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Oct 8, 2013
Issued Date -
N/A
app pub date -
Jan 6, 2009
filing date -
Jan 9, 2008
priority date (Note) -
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status (Latency Note)
Importance
Abstract
In the wiring board, insulating layers and wiring layers are alternately laminated, and the wiring layers are electrically connected by the vias. The wiring board includes first terminals arranged in a first surface and embedded in an insulating layer, second terminals arranged in a second surface opposite to the first surface and embedded in an insulating layer, and lands arranged in an insulating layer and in contact with the first terminals. The vias electrically connect the lands and the wiring layers laminated alternately with the insulating layers. No connecting interface is formed at an end of each of the vias on the land side but a connecting interface is formed at an end of each of the vias on the wiring layer side.
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