Process of assembling a probe
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United States of America Patent
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Oct 15, 2013
Grant Date -
Nov 10, 2011
app pub date -
May 5, 2010
filing date -
May 5, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A process of assembling a probe that includes providing a circuit board that is connectable to a sensor and is connected to a first electrical connector and sliding a housing that has a first end and a second end over the circuit board. The process includes sealingly connecting the first end of the housing and the first electrical connector with a water-tight seal and sealing the second end of the housing with a water-tight seal. Also disclosed is a probe made by the disclosed processes and a sonde including a probe made by the disclosed processes.
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