Coating-forming liquid composition and coating-forming method therewith
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United States of America Patent
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Oct 15, 2013
Grant Date -
Oct 18, 2012
app pub date -
Apr 13, 2012
filing date -
Apr 18, 2011
priority date (Note) -
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Abstract
Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.
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