Heat sink and assembly or module unit

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United States of America Patent

PATENT NO 8559475
APP PUB NO 20100290490A1
SERIAL NO

12450505

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Abstract

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A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and which is made of a metallic material in the cooling area.

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Patent Owner(s)

Patent OwnerAddress
ROGERS GERMANY GMBH92676 ESCHENBACH

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hammel, Ernst Vienna, AT 23 350
Schulz-Harder, Jürgen Lauf a.d. Pegnitz, DE 16 77

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