Fungal modified chitosan adhesives and wood composites made from the adhesives
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United States of America Patent
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Oct 22, 2013
Grant Date -
Aug 4, 2011
app pub date -
Jan 21, 2011
filing date -
Feb 1, 2010
priority date (Note) -
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Abstract
The present invention describes a fungal modified chitosan adhesive for binding a fibrous material and the method of producing the adhesive. The adhesive is produced by providing a chitosan containing raw material; a fungal growing medium; a fungal culture; mixing the raw material, the growing medium and the fungal culture together to produce a suspension; incubating the suspension to produce a broth comprising a modified chitosan solid, an at least partially-consumed medium liquid and a fungal residue; separating the modified chitosan solid from the liquid and the fungal residue, and dissolving the modified chitosan solid to produce the adhesive resin.
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