Wafer fabrication process

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United States of America Patent

PATENT NO 8562749
APP PUB NO 20120231397A1
SERIAL NO

13475997

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Abstract

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A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.

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Patent Owner(s)

Patent OwnerAddress
BRUKER NANO INC3400 E BRITANNIA DRIVE SUITE 150 TUCSON AS 85706

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brinkley, David Baltimore, US 19 78
LeClaire, Jeffrey E Boca Raton, US 24 120
Roessler, Kenneth G Boca Raton, US 14 111

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