Integrated acoustic bandgap devices for energy confinement and methods of fabricating same
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United States of America Patent
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Oct 22, 2013
Grant Date -
Apr 26, 2012
app pub date -
Dec 29, 2011
filing date -
Dec 17, 2007
priority date (Note) -
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Abstract
The present invention is directed to monolithic integrated circuits incorporating an oscillator element that is particularly suited for use in timing applications. The oscillator element includes a resonator element having a piezoelectric material disposed between a pair of electrodes. The oscillator element also includes an acoustic confinement structure that may be disposed on either side of the resonator element. The acoustic confinement element includes alternating sets of low and high acoustic impedance materials. A temperature compensation layer may be disposed between the piezoelectric material and at least one of the electrodes. The oscillator element is monolithically integrated with an integrated circuit element through an interconnection. The oscillator element and the integrated circuit element may be fabricated sequentially or concurrently.
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