Method and apparatus for warming up integrated circuits

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United States of America Patent

PATENT NO 8572412
SERIAL NO

13015139

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Abstract

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Aspects of the disclosure provide an integrated circuit (IC) chip. The IC chip includes functional circuits configured to perform desired functions when a chip temperature is higher than a threshold, such as a room temperature. The IC chip includes a warm-up module configured to warm-up the IC chip in a warm-up mode to raise the chip temperature above the threshold. A method for warming up an IC chip prior to operation is also disclosed.

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Patent Owner(s)

  • MARVELL ISRAEL (M.I.S.L.) LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Solt, Yosef Atzmon-Segev, IL 25 146

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