Electroplating method for coating a substrate surface with a metal

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United States of America Patent

PATENT NO 8574418
APP PUB NO 20100038256A1
SERIAL NO

11992372

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Abstract

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The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the surface to be coated is brought into contact with an electroplating bath while the surface is not under electrical bias; a step of forming the coating during which the surface is biased; a step during which the surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40mM; and at least one copper complexing agent.

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Patent Owner(s)

  • ALCHIMER

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Daviot, Jérôme Leuven, BE 5 6
Gonzalez, José Paris, FR 7 19
Monchoix, Hervé Saint Isnier, FR 8 19
Raynal, Frédéric Paris, FR 5 20

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