Methods and apparatus for applying adhesives in patterns to an advancing substrate
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United States of America Patent
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Nov 5, 2013
Grant Date -
Aug 23, 2012
app pub date -
Apr 30, 2012
filing date -
May 5, 2010
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Methods and apparatuses herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The substrate carrier may include one or more pattern elements and may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, the substrate is disposed on the substrate carrier; the substrate carrier advances the substrate past the slot opening of the slot die applicator. In turn, the substrate is intermittently compressed between the slot die applicator and the pattern surface of the pattern element. As the substrate is intermittently compressed, adhesive discharged from the slot die applicator is applied onto the substrate in an area having a shape substantially the same as a shape defined by the pattern surface.
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