Heat dissipation device with heat pipe
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United States of America Patent
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Nov 12, 2013
Grant Date -
Apr 28, 2011
app pub date -
Jan 15, 2010
filing date -
Oct 22, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
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