Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer

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United States of America Patent

PATENT NO 8580070
APP PUB NO 20110155297A1
SERIAL NO

11720954

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Abstract

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The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.

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Patent Owner(s)

  • POLARIS INNOVATIONS LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bauer, Michael Nittendorf, DE 249 3867
Fuergut, Edward Dasing, DE 159 1996
Jerebic, Simon Regensburg, DE 56 410
Vilsmeier, Hermann Höhenkirchen, DE 14 148

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