Laser processing apparatus, laser processing head and laser processing method
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United States of America Patent
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-
Nov 12, 2013
Grant Date -
Sep 13, 2007
app pub date -
Aug 25, 2006
filing date -
Mar 7, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.
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