Methods and apparatus for sputtering

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8585873
APP PUB NO 20060081458A1
SERIAL NO

11247199

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Abstract

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A method of sputtering with sputtering apparatus is for depositing a layer upon a substrate. The apparatus includes a sputter target with a face exposed to the substrate and a magnetron providing a magnetic field that moves relative to the target face. The speed of movement of the field is controlled such that the uniformity of the deposition on the substrate is enhanced. A particular method includes monitoring uniformity verses speed, selecting the speed that gives the preferred uniformity and controlling the field to the selected speed. The selected speed may vary over the life of the target, with increased speeds becoming desirable as the target thins.

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Patent Owner(s)

  • AVIZA TECHNOLOGY LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ford, Mark Ashley Bristol, GB 2 19
Jakkaraju, Rajkumar Gwent, GB 12 141

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