Multilayer capacitor, manufacturing method thereof, circuit board, and electronic device
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United States of America Patent
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Nov 19, 2013
Issued Date -
N/A
app pub date -
Oct 13, 2010
filing date -
Oct 16, 2009
priority date (Note) -
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Abstract
Provided is a multilayer capacitor that can be manufactured with high yields and whose warpage is suppressed. The multilayer capacitor includes two or more laminated bodies which are bonded together, the two or more laminated bodies each including resin layers and metal layers which are alternately laminated a plurality of times in a thickness direction and each being warped and having front and rear surfaces covered with surface layers containing a resin material, one of the front and rear surfaces being formed of a first surface as a smooth surface having no recess portion, another of the front and rear surfaces being formed of a second surface having a recess portion, in which at least two adjacent laminated bodies are bonded together at the first surfaces or the second surfaces. Also provided are a manufacturing method for the multilayer capacitor, and a circuit board and an electronic device which use the multilayer capacitor.
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